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Shenzhen Jingxin Electronic Technology Co., Ltd.
Shenzhen Jingxin Electronic Technology Co., Ltd.
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Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process

Brand Name : Jingxin
Model Number : JX81107S09
Certification : UL,RoHS, CE
Place of Origin : China
MOQ : 1 pc
Price : Negotiable
Supply Ability : 100000pcs per day
Packaging Details : ESD package
Base Material : FR4 Aluminum CEM-1 9
Min. Line Width : 0.10mm (4mil)
Application : Electronic Products
PCB Clone : Support
Service : EMS.ODM.OEM
Surface Treatment : HALS/Chemical Tin/S
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Multilayer Prototype EMS PCB Assembly High Volume PCB Manufacturing Process


Our capacity

Item (PCB)
Manufacture Capacity
Layer
1-20 layers
Material
FR4, High-TG FR4, CEM3,Aluminum,High Frequency(Rogers, Taconic,Aron,PTFE,F48)
Material Thickness (mm)
0.2 to 4.0mm/Flex 0.01-0.25mm
Copper Thickness
0.5-3.0oz
Min Line Space
0.1mm(4mil)
Min Line Width
0.1mm(4mil)
Hole
Min Hole Size (mechanical)
0.2mm
Min Hole Size(laser)
0.1mm
Hole Size Tol(+/-)
PTH: ±0.075mm; NPTH:±0.05mm
Hole Position Tol
±0.075mm
Plating
HASL/LF HAL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5"
Surface Finish
HAL, ENIG, Plated Gold, Immersion Gold, OSP
Copper Weight
0.5-6oz
Color
Solder Mask
Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silk Screen
White, Black, Blue, Yellow
Acceptable File Format
Gerber file, Powerpcb,CAD,AUTOCAD,ORCAD, P-CAD,CAM-350,CAM2000
Certificate
ROSH, ISO9001,UL
Item (PCB Assembly)
Manufacture Capacity
Stencil Size
700x700mm
Min IC Pitch
0.2mm
Max PCB Size
1200x500mm
Min PCB Thickness
0.25mm
Min Chip Size
0201(0.2x001)/0603(0.6x0.3mm)
Max BGA Size
74x74mm
BGA Ball Diameter
0.4mm(min),1.00mm(max)
BGA Ball Pitch
1.00(min), 3.00mm(max)
QFP Lead Pitch
0.38mm(min),2.54mm(max)
Assembly Type
Surface Mounting Assembly
DIP Assembly
Mixed (surface mount and through hole) technology
Single or double sided placement
Cable Assembly

Component Type
Passive Component
As small as 0402 package
As small as 0201 with design review
Ball Grid Array (BGA)

Solder Type
Leaded
Leaded-free/ROHS
Other Capabilities
Repair/Rework Service
Mechanical Assembly
Mold and Plastic injection


Our Service


1. PCB design, PCB clone, ODM service, Android PCBA

2. Schematic design and layout

3. Fast PCB&PCBA prototype and mass production

4. Electronic components sourcing services

5. PCB Assembly services:SMT/DIP&THT,BGA repair and reballing

6. ICT, Constant Temperature Burn-in and Function Test

7. Stencil, Cables and Enclosure building

8. Standard Packing and On-Time Delivery


9. Support OEM service


Requested information for PCB assembly

1. Gerber file of the bare board/ electronic circuit board

2. BOM for PCB assembly (To shorten time, please kindly advise us if there is any acceptable components substitution)

3. Testing Guide & Test Fixtures if necessary

4. Programming files & Programming tool if necessary

5. Schematic if necessary


About Company

1. Shenzhen Jingxin Electronics Co., Ltd is a manufacturer specialized in PCB&PCBA manufacturing, related R&D over 14 years.

2. One stop turnkey services, including PCB board manufacturing, PCB layout, PCB assembly, components source, PCB board SMT, function testing, quality testing etc.


3. JINGXIN is the direct customer of original QUAL COMM/MTK/REALTEK and worked with Arrow, Avnet, WPG etc famous IC suppliers for over 10 years.

4. With 20 lines of SMT lines, 20 sets of famous brand Wifi testing machines, 500,000pcs of router production capacity.

5. Strict manufacturing and quality test control, machinery and labor work together to ensure testing quality.

6. OEM and ODM are warmly welcome.

7. Certifications: ISO 9001,CE RoHS, Nation High-tech industry.

Lead Time


SampleMass Production
Single Sided PCB1-3 days4-7 days
Double Sided PCB2-5 days7-10 days
Malti-layer PCB7-8 days10-15 days
PCB Assembly8-15 days15-20 days


Product Tags:

pcb board assembly

      

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